Samsung has begun shipping HBM4 memory for AI accelerators commercially. The company says production uses a 10 nm-class DRAM process with a 4 nm logic base die, delivering 11.7 Gbps per pin, up to 3.3 TB/s per stack, and 24–36 GB capacities.
Taoglas has launched an AI antenna recommendation engine worldwide. The tool shortlists antennas using project constraints, aiming to cut early RF selection time and reduce late-stage redesign and certification churn.
Mastercam 2026.R2 shifts simulation workloads from CPU to GPU hardware. A new GPU-accelerated verifier and the Copilot assistant target faster toolpath checks and fewer repetitive edits, as the company moves to a twice-yearly major release cadence.
Omron’s S8AS2 targets crowded control cabinets with smarter DC distribution. It combines a 24 V power supply, branch-level electronic protection, and live diagnostics, aiming to simplify wiring and isolate faults without taking an entire panel offline.
Renesas will license EPC’s eGaN for low-voltage power devices globally. The deal adds second-sourcing and aims to accelerate GaN adoption in AI power, robotics, and compact converters.
Industrial touchscreens have stripped tactile feedback from many HMIs today. Ross Turnbull, Director of Business Development at Swindon Silicon Systems, explains how custom ASICs enable precise, closed-loop haptics that makes digital panels feel more like physical controls.