Quantum sensing is entering Europe’s semiconductor inspection production chain quickly. QuantumDiamonds will build a Munich test-equipment facility with €76m in German support.
TDK has introduced 3D Hall switches for compact drive applications. HAL 13xy targets motor speed and direction sensing.
Thintronics has been recognised for low-loss dielectric materials development work. Its materials target boards, packages, and semiconductor interconnect structures.
La Luce Cristallina releases beta 200mm wafers for photonics evaluation. The BaTiO₃ platform targets low-voltage electro-optic modulator designs.
Vishay has introduced high-isolation optocouplers for 800V electric vehicle systems. VOLA617A targets chargers, converters, battery management, and industrial automation.
TE Connectivity has expanded compact interconnect options for industrial designs. AMP SMC essential connectors target board-to-board and board-to-wire applications.