Category: Products
-
Advanced Energy raises brick power density without changing thermal geometry. The new AIF13WAC lifts output to 600 W in the same full-brick format, adding PMBus control, active current sharing, and an upgrade path for existing 500 W telecom and industrial designs.
-
Kight is turning domestic batteries into a scaled manufacturing proposition. Its planned Dumfries plant would assemble AI-managed 10kWh home storage systems built around a non-graphite anode chemistry and an EnergiFlow control stack tuned to tariff, demand, and grid signals.
-
ROHM is turning SiC module evaluation into reusable inverter platforms. Three new reference designs package board-level design data around its latest modules across industrial and automotive power-conversion applications.
-
Mythic is hardening analog AI around foundry-ready embedded memory technology. Its next APU generation will use SST’s memBrain and SuperFlash to push compute-in-memory efficiency further into deployable silicon.
-
ST is moving robotics integration closer to production-ready physical AI. Its latest NVIDIA collaboration links sensing, control, and simulation tools more tightly across Holoscan Sensor Bridge, Jetson, and Isaac Sim.
-
Molex is recasting AI optics around serviceability, density, and scale. Its latest roadmap combines blind-mate backplanes, detachable fiber-to-chip links, external laser connectivity, and a high-radix optical switch for larger GPU clusters.
-
Teledyne shifts extreme acquisition toward storage architectures built for continuity. Its ADQ35 and libads combination brings sustained 25 GB/s-class disk streaming into deployable RAID configurations for long-duration capture, rather than treating storage as a downstream bottleneck.
-
ABLIC is widening its analogue strategy in Europe and the US. The move centres on battery protection, automotive power, Hall sensing, medical ultrasound electronics, and batteryless water leak detection.
-
Keysight has extended optical component validation to 220 GHz. The new platform targets the measurement bottlenecks emerging around 1.6T and 3.2T optical transceiver development for AI and data centre interconnects.
-
SolidRun has pushed edge AI deeper into embedded compute. Its new COM Express Type 6 modules pair AMD’s Ryzen AI Embedded P100 with LP-CAMM2 memory and up to 59 TOPS for harsh-environment deployments.