Marktech has expanded its COTS and custom photodetector and LED capabilities with transfer-moulded packaging technology. The platform targets defence and aerospace sensing, targeting, and optical alignment systems requiring compact, rugged, and repeatable optoelectronic packages.
ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.
JEDEC has released JEP203 and JEP204 for silicon carbide power semiconductors. The documents cover short-circuit evaluation and stress procedures, supporting more consistent qualification of SiC devices in EVs, industrial drives, renewable systems, and high-power electronics.
Bull and Foxconn will manufacture AI and cloud infrastructure across France and the Czech Republic. The partnership targets AI factories, neo-cloud providers, enterprises, and research institutions, with an initial investment expected to exceed €120m.