Taoglas is shrinking multi-radio antenna integration into tighter device footprints. Its new FXP30x and PC30x families combine cellular, GNSS, and Wi‑Fi support in flexible and rigid PCB formats for compact connected products.
AI hardware efficiency is pushing materials science back into focus. Cambridge researchers have developed a hafnium oxide memristor that could cut energy use in analogue in-memory computing.
Sensor authenticity is becoming a hardware problem, not software alone. ETH Zurich has built a chip that signs data at capture to help expose manipulated media.
Programmable photonics is edging closer to practical semiconductor deployment. Lumotive’s new 2D beamforming chip points to flatter optical architectures for sensing, communications, and AI data-centre networking.
Semiconductor education is shifting toward lab-ready workflows and measurement discipline. Keysight’s new university packages bring device test, on-wafer analysis, and photonic IC measurement into structured teaching labs.
Cooling hardware is tightening efficiency as AI data-centre loads rise. Delta’s latest ErP 2026-compliant EC fans at MCE 2026 target lower-power, lower-harmonic thermal management for data-centre and HVAC deployments.
Infineon and DG Matrix are pushing silicon carbide further upstream. Their collaboration puts SiC devices into solid-state transformer platforms aimed at AI data centres and industrial power infrastructure.
Delta is bringing a tightly integrated electronics stack to LogiMAT. Charging, 3D time-of-flight vision, motion control, industrial computing, and robotics are being shown as one coordinated intralogistics platform.
MARS Bioimaging has secured FDA clearance for portable photon-counting CT. The decision opens the US market for a compact upper-extremity imaging system built around detector technology originally developed through CERN’s Medipix3 work.