Category: Products
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TE Connectivity has expanded access to 1,500V bidirectional DC contactors. The devices target storage, charging, marine, data-centre, and industrial power systems.
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Microchip has expanded FPGA edge-AI deployment with sparse-network acceleration tools. VectorBlox 3.0 targets lower memory traffic, power use, and inference latency.
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Arm is extending automated hardware-security analysis across future CPU programmes. The work moves vulnerability detection earlier while preserving reusable assurance across designs.
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Infineon has introduced a radiation-hardened gate driver for orbital power. The device supports GaN and silicon switching stages in high-reliability converter designs.
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ASML raised its 2026 sales forecast as AI investment accelerates. The revision reflects stronger demand across advanced logic, memory, and lithography capacity.
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Abaco Systems has launched a rugged Core Ultra 3 SBC. The SOSA-aligned VPX board combines CPU, GPU, NPU, FPGA security, 100G Ethernet, and optional TSN.
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Spain is connecting domestic semiconductor research, design, and manufacturing projects. The programme spans RISC-V chiplets, analogue IP, prototyping, materials, and edge processing.
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Infineon and LS Electric will develop high-efficiency DC power systems. Their programme covers energy storage, solid-state transformers, fast protection, and AI data-centre infrastructure.
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NextGO Epi has raised €2m to scale gallium-oxide epiwafers production. The Berlin company is targeting high-voltage power devices while addressing thermal, reliability, packaging, and yield constraints.
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Intel will invest €5bn to expand processor manufacturing at Leixlip. The programme adds Intel 3 capacity, equipment, automation, and cleanroom utilisation for Xeon 6 and later products.