Littelfuse has released surface-mount TVS diodes for avionics protection applications. The new devices bring DO-160 Waveform 5A Level 5 lightning protection into standard SMT assembly flows.
Inelco Hunter has added sealed coolant temperature sensors to distribution. The Amphenol devices target compact thermal loops across electrified systems and cooling architectures.
Renesas has extended its GaN charging platform to 500W today. The new HWLLC architecture targets denser, cooler AC/DC designs across industrial, infrastructure, and connected systems.
Power Integrations has pushed flyback conversion into higher output ranges. The new TOPSwitchGaN family targets applications that previously moved to more complex resonant architectures.
SmartRay has brought reflective-surface inspection into its ECCO X family.
Infineon is packing more current into the AI power stage. Its latest TLVR module targets the growing board-level constraints inside AI servers, where power density, transient response, and thermal headroom are becoming central design limits.
RANsemi has secured a tactical 5G baseband design win now. Its RNS802 SoC sits at the heart of Apeiroon’s deployable 4G and 5G systems for defence, public safety, and temporary private networks.