Category: Markets
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Wallbox has launched Pulsar Pro for metered EV charging deployments. The AC charger integrates MID-certified measurement, reimbursement reporting, RFID access, load balancing, solar integration, and remote management for European installations.
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SAB Cables is highlighting high-flex cabling for automation system builders. The portfolio covers continuous-motion, drag-chain, compact control, data, and custom cable designs for robotics and machinery applications.
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SEMI has mapped barriers to clinical wearable biosensor adoption globally. The work covers semiconductor integration, signal quality, AI, validation, cybersecurity, interoperability, and regulation as wearables move beyond wellness use.
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Infineon and VinRobotics will collaborate on humanoid robot platform development. The work combines semiconductor, sensing, power, connectivity, safety, security, and robotics expertise through a joint competency centre in Hanoi.
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Rapidus has signed a UK agreement on semiconductor manufacturing collaboration. The MoU links UK semiconductor strategy with Japan’s advanced 2nm logic manufacturing plans.
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Taiwan Semiconductor has added TQM MOSFETs for compact power designs. The automotive-grade devices target conversion, motor control, 48V rails, and high-reliability DC-DC converters.
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Toshiba has expanded its MOSFET range for industrial power rails. The 60V and 100V devices target PLCs, servo drives, servers, inverters, and LED lighting.
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Kontron has introduced a rugged TSN switch for defence networks. CERES-TSN combines deterministic Ethernet, optical interfaces, secure management, and European-controlled manufacture.
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Xiphera is joining Finland’s SecureSoC programme for trusted semiconductor systems. The project links hardware cryptography, RISC-V design, AI-assisted verification, and supply-chain resilience.
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Legacy aerospace and satellite platforms face rising connectivity demands. Filtronic CTO Tudor Williams explains how solid-state power amplifiers can replace travelling wave tube amplifiers, improving reliability, reducing maintenance, and enabling higher-throughput links without the cost and complexity of full platform redesigns.