Category: Products
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Sequencing hardware is becoming a semiconductor sensor problem again today. Roche’s AXELIOS 1 combines SBX chemistry, nanopores, reusable CMOS modules, and near real-time analysis.
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Power IC integration is moving further onto engineered substrates now. Soitec and ZenSemi will scale 300mm BCD-on-SOI production for AI, EV, robotics, storage, and industrial systems.
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Quantum sensing is entering Europe’s semiconductor inspection production chain quickly. QuantumDiamonds will build a Munich test-equipment facility with €76m in German support.
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TDK has introduced 3D Hall switches for compact drive applications. HAL 13xy targets motor speed and direction sensing.
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Thintronics has been recognised for low-loss dielectric materials development work. Its materials target boards, packages, and semiconductor interconnect structures.
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La Luce Cristallina releases beta 200mm wafers for photonics evaluation. The BaTiO₃ platform targets low-voltage electro-optic modulator designs.
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Ubotica has raised funding to scale orbital maritime intelligence services. Live Maritime Intelligence uses onboard AI and autonomous satellite tasking.
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Code Metal has expanded its RF engineering capability through acquisition. Signal Processing Technologies adds SDR, spectrum sensing, and DSP expertise.
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Vishay has introduced high-isolation optocouplers for 800V electric vehicle systems. VOLA617A targets chargers, converters, battery management, and industrial automation.
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Arrow has introduced an industrial AMR reference design platform package. The system combines ST electronics, NVIDIA compute, and ROS 2 software.