Kioxia has begun sampling 332-layer tenth-generation BiCS Flash memory devices. Direct wafer bonding raises density and interface speed while reducing read and write power.
GigaDevice has entered the industrial EEPROM market with GD24CL devices. Endurance reaches four million write cycles, with retention specified at 100 years.
Signify recorded weaker European professional-lighting demand during its second quarter. Comparable sales fell 3.6%, while adjusted EBITA margin declined to 6.1%.
Navitas and Magnachip will jointly manufacture higher-voltage silicon carbide devices. Ratings from 1,200V beyond 3,300V will address grid, storage, transport, and industrial conversion systems.
Exascend has extended rugged storage into industrial PCIe 5.0 systems. New enterprise and embedded options combine high capacity, power-loss protection, wide-temperature operation, and endurance-focused pSLC configurations.
Fortec UK has introduced one converter for five railway voltages. The 150W HFC150-W/G accepts inputs from 14.4V to 154V, allowing one power architecture to span several rolling-stock platforms.
Texas Instruments has compressed isolated bias power into one module. The UCC33420-Q1 integrates its transformer and power stage while providing a regulated 1.5W output and 3kVRMS isolation.
Schurter has introduced a low-profile switch for fixed hardware configuration. The DMSD family combines standard 2.54mm spacing with automated assembly compatibility and an industrial operating-temperature range.